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TB62801F
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
TB62801F
Linear CCD Clock Driver
TB62801F is a clock distribution driver for CCD linear image sensors. The IC can functionally drive the CCD input capacitance. It also supports inverted outputs, eliminating the need for crosspoint control. The IC contains a 1 to 4 clock distribution driver for the main clock and 4-bit buffers for control signals.
Features
* * High drivability: Guaranteed driving 450 [pF] load capacitance @fclock = 20 [MHz] Operating temperature range: Ta = -25C to 60C Weight: 0.5 g (typ.)
Pin Connection (top view)
2B_ out
1 2 3 4
16 15 14 13
2B_out CP_out
2B_in CP_in VCC
GND
GND
VCC CK_in SH_in RS_in
5 6 7 8
12 11 10 9

SH_out RS_out
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Logic Diagram
2B_ out 2B_in CP_in 2B_out CP_out CK_in SH_in RS_in SH_out RS_out
Pin Description
Pin No.
1 2 3 4
Pin Name
2B_ out 2B_in CP_in VCC GND
Functions
Light-load drive output (inverted) Light-load drive input Light-load drive input Power supply Ground Power supply Heavy-load drive input Light-load drive input Light-load drive input Light-load drive output (not inverted) Light-load drive output (not inverted) Heavy-load drive output (not inverted) Heavy-load drive output (inverted) Ground Heavy-load drive output (inverted) Heavy-load drive output (not inverted) Light-load drive output (not inverted) Light-load drive output (not inverted)
Remarks
Driver output for CCD last-stage clock Driver input for CCD last-stage clock CCD clamp gate driver input

Driver input for CCD transfer clock CCD shift gate driver input CCD reset gate driver input CCD reset gate driver output CCD shift gate driver output Driver output for CCD transfer clock Driver output for CCD transfer clock
5 6 7 8 9 10 11 12
VCC CK_in SH_in RS_in RS_out SH_out GND
Driver output for CCD transfer clock Driver output for CCD transfer clock CCD clamp gate driver output Driver output for CCD last-stage clock
13 14 15 16
CP_out 2B_out
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Truth Table
Input
L 2B_in H L H CP_in L H L CK_in H L H SH_in L H L H 2B_ out
Output
H L L H L H L H H L L H L H
2B_out
CP_out
SH_out
RS_in
RS_out
Absolute Maximum Ratings (Ta = 25C)
Characteristic
Power supply voltage Input voltage Output voltage Input clamp diode current (Vi < 0) Output clamp diode current (VO < 0)
Symbol
VCC VIN VO IIK IOK IOH (O/ O )
Rating
-0.5 to 7.0 -1.2 to VCC+0.5 -0.5 to VCC -50 -50
Unit
V V V mA mA
Output current
High level
-16.0 16.0 -100 150
-25 to 60 -40 to 100
mA mA mA mA
excluding other Low level than , outputs
output current
IOL (O/ O ) IOH (/ ) IOL (/ ) Topr Tstg Tj PD
High level Low level
Operating temperature Storage temperature Junction temperature Power dissipation

W
150 1.5
Note: Output current is specified as follows: VOH = 4.0 V, VOL = 0.5 V.
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Recommended Operating Conditions
Characteristic
Power supply voltage Input voltage Output voltage Output current excluding , outputs
output current
Symbol
VCC VIN VO
Min
4.7 0 0
Typ.
5.0
Max
5.5 VCC VCC
-8.0
Unit
V V V mA mA mA mA C ns

25 2.5
High level Low level High level (Note) Low level
IOH (O/ O ) IOL (O/ O ) IOH (/ ) IOL (/ ) Topr tri/tfi

-25
8.0
-20.0
20.0 60 5.0
Operating temperature Input rise/fall time
Note: Output current is specified as follows: VCC = 4.7 V, VOH = 4.5 V, VOL = 0.2 V. Input rise/fall time is specified as 10 % to 90 % of waveform amplitude.
Electrical Characteristics DC Characteristics (unless otherwise specified, VCC = 4.7 to 5.5 V, Ta = -25 to 60C)
Characteristic
Input voltage High Low
Symbol
VIH VIL VIK VOH (/ )
Test Circuit
1, 2 3
Test Condition

VCC
4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 4.7 5.5 5.5
Min
2.0 0
Typ.

Max
VCC 0.8 1.0 VCC VCC VCC 0.2 0.5 2.5 VCC VCC 0.2 0.5 1.0 15.0
Unit
V V
Input clamp voltage
IIK = -30 mA IOH = -10 mA IOH = -50 mA IOH = -300 mA IOL = 100 A
4.5 4.0 2.5 0 0 0 4.5 4.0 0 0

4, 5
output voltage
V
VOL (/ )
6, 7
IOL = 50 mA IOL = 300 mA IOH (O / O ) = -4 mA IOH (O / O ) = -16 mA IOL (O / O ) = 4 mA IOL (O / O ) = 16 mA VIN = VCC or GND
outputs: High or Low outputs: Low or High Other outputs are High
VOH (O/ O ) Output voltage excluding , outputs VOL (O/ O ) Input voltage Total IIN ICC
ICC
4, 5
V
6, 7 8 9
A
Static current consumption
mA

Each bit Output off mode supply voltage
10
One input: VIN = 0.5 V Other inputs: VCC or GND See description on next page.
1.5
VPOR
3.0
V
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Output Low-Level Fixed Mode at Power On
* * * To avoid malfunction at power on, this IC incorporates the following functions: All outputs are fixed to low level until VCC reaches more than 3 V. When VCC reaches 3 V (typ.), the internal logic depends on input signals. VCC must be more than 4.7 V for normal operation.
Supply voltage Power VCC 3V Output signal waveform GND Additional circuit (P.O.R) test circuit VCC
Pulse generator
DUT
Output signal waveform Low-level state
Time
AC Characteristics (input transition rise or fall time: tr/tf = 2.5 ns)
Normal Temperature/ VCC = 5.0 V Min
tpLH (/ ) tpHL (/ ) Propagation delay time tpLH (O/ O ) tpHL (O/ O ) Output skew excluding
, outputs
Characteristic
Symbol
Test Condition
All Temperatures/ VCC = 4.7 to 5.5 V Min
7.0 6.0 7.0 6.0 2.5 1.5 2.5 1.5
Unit
Reference Measurement Diagram
Typ.
10.0 9.0 10.0 9.0 5.0 4.0 5.0 4.0

Max
14.0 13.0 14.0 13.0 7.0 6.0 7.0 6.0 2.0
Max
16.0 15.0 16.0 15.0 8.0 7.0 8.0 7.0 2.0
CL = 450 pF CL = 350 pF CL = 450 pF CL = 350 pF CL = 30 pF CL = 15 pF CL = 30 pF CL = 15 pF CL = 30 pF CL = 300 to 450 pF
7.0 6.0 7.0 6.0 3.0 2.0 3.0 2.0 0
ns
Measurement diagram 1
ns
Measurement diagram 2
to (skw) VT (crs)
ns V
Measurement diagram 3 Measurement diagram 4
Output crosspoints (1/2)
1.5
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Waveform Measuring Point
Propagation Delay Time Setting
Input signal * 2B_in * CK_in * SH_in * RS_in * CP_in
tri 90% 1.5 V 10% VCC - 0.5 V 90% 1.5 V 10% GND VCC tpHL (O) GND + 0.5 V VCC - 0.5 V tpLH ( O ) GND VCC tfi 3.0 V
Measurement Diagram 1
Output signal * Output signal *
tpLH (O)
tpHL ( O ) GND + 0.5 V VCC - 0.5 V tpLH (1)
Measurement Diagram 2
Output signal * 2B_out * CP_out * SH_out * RS_out Output signal * 2B_out
GND VCC tpHL (1) GND + 0.5 V VCC - 0.5 V tpLH (2) GND VCC
tpHL (2) GND + 0.5 V
GND VCC
Measurement Diagram 3
Output signal * 2B _ out * 2B_out * CP_out * SH_out * RS_out
GND to (skw) to (skw)
Output Waveform Crosspoint/Level Setting
Measurement Diagram 4
*
VT (CRS) VOL GND VOH
*
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Reference Data (typ. value)
12 11
tpLH (), tpHL () - CL (characteristics of 1-output, other outputs: no load)
120
Load capacitance versus maximum operating frequency (all bits in operation) VCC = 5.0 V, Ta = 25C, tri/tfi = 2.5 ns
Note: Propagation delay time is specified in accordance with the attached sheet. VCC = 5.0 V, Ta = 25C, tri/tfi = 2.5 ns
(ns)
100
10 9 8 7 6 5 4 50
Frequency (MHz)
450 550 650
Propagation delay time
80
60
40
150
250
350
Note: Maximum operating frequency: Under specified load conditions, the frequency when the pulse width of the output signal matches that of the input signal; or 20 the frequency at which the specified amplitude is obtained. Note that light-load bits are fixed to a capacitance of 30 pF. 0 50 100 150 200 250 300 350 400
450
Capacitance
(pF)
Capacitance
(pF)
Frequency versus power dissipation, temperature (@all outputs: maximum load capacitance)
1.4 Power dissipation 1.2 Rise in temperature 1.4 80 100 1.6
PD - Ta
Mounted on test board IC only
(C)
(W)
1.0 0.8 0.6 0.4 0.2 0.0 0.0E + 0 60
1.2 1.0
Rise in temperature
Power dissipation
(W) PD
0.8 0.6 0.4 0.2 0.0 0
Note: CL (/ ) = 450 pF, CL = (O/ O ) = 30 pF Output amplitude = 4.5 V Supply voltage = 5.5 V Mounted on 50 mm x 50 mm glass-epoxy board 5.0E + 6 1.0E + 7 1.5E + 7
40
20
Note: Test board: 50 mm x 50 mm glass-epoxyboard. 25 50 75 100 125 150
0 2.0E + 7
Frequency (Hz)
Ta
(C)
/ output IOL - VOL
1.0 Ta = 25C 0.0 Ta = 25C VCC = 4.7 V
/ output IOH - VOH
(A)
(A) High-level output current IOH
VCC = 4.7 V 0.8
Low-level output current
IOL
-0.2 (*) Subtract amplitude voltage with VCC as reference. -0.4
0.6
0.4
-0.6
0.2
-0.8
0.0 0.0
1.0
2.0
3.0
4.0
5.0
-1.0 -5.0
-4.0
-3.0
-2.0
-1.0
0.0
Low-level output voltage
VOL
(V)
High-level output voltage
VOH
(V)
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Test Circuit
DC Parameters
Pins marked with an asterisk (*) are test pins. However, ground any input pins that are not being used as test pins so that their logic is determined. Unless otherwise specified, bits of the same type are measured in the same way.
*
VIH/VIL
(1) Light-load drive bit
1 4.7 V 0 to VCC 16 15 14 13 30 pF E.g., oscilloscope
2 3
4
5 6
12 11 10 9
7 8
(2)
Heavy-load drive bit
1 4.7 V 2 3 4
16 15 14 13 450 pF E.g., oscilloscope
5
12 11 10 9
6
7 0 to VCC 8
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* VIK
1 4.7 V
16 15 14 13
2 3
4
5
12 11 10 9
6 7 8
-30 mA
V
Note 1: When measuring input pins, connect the input pins that are not being measured to GND.
*
VOH (O/)
1 4.7 V 2 3 4
16 15 14 13
5 6 7 8
12 11 10 9 V O output: -4/-16 mA output: -10/-50/-300 mA
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* VOH ( O / )
1
4.7 V 2 3 4
16 15 14 13
5 6 7 8
12 11 10 9 V O output: -4/-16 mA output: -10/-50/-300 mA
*
VOL (O/)
1 4.7 V 2 3 4
16 15 14 13
4.7 V 5 6 7 8 12 11 10 9 V O output: 4/16 mA output: 100 A/50/300 mA
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*
VOL ( O / )
4.7 V
1
4.7 V 2 3 4
16 15 14 13 V O output: 4/16 mA output: 100 A/50/300 mA
5 6 7 8
12 11 10 9
*
IIN
1 5.5 V
16 15 14 13
2 3
4
5.5 V 5 A 12 11 10 9
6 7 8
A
Note:
When measuring input pins, connect the input pins that are not being measured to GND.
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TB62801F
*
ICC
5.5 V 3V 1 A 2 3 16 15 14 13
4
5
6 7 8
12 11 10 9
Note 1: The input logic of the heavy-load drive clock input pin (pin 6) is the same for High or Low.
*
ICC
VCC 1 A 2 3 16 15 14 13
4
5
6 0.5 V 7 8
12 11 10 9
Note 2: When measuring input pins, connect the input pins that are not being measured to GND or power.
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TB62801F
AC Parameters
Pins marked with an asterisk (*) are test pins. Ground the input pins that are not being used as test pins so that their logic is determined. Unless otherwise specified, bits of the same type are measured in the same way.
*
Propagation Delay Time
(1) Light-load drive bit
1
2 VCC 0 to 3 V 3 4
16 15 14 13 15/30 pF
E.g., oscilloscope
5 6 7 8
12 11 10 9
(2)
Heavy-load drive bit
1 2 VCC 3 4
16 15 14 13 E.g., oscilloscope 350/450 pF
5 6 0 to 3 V 7 8
12 11 10 9
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TB62801F
*
Light-Load Drive Output Skew
30 pF
1
2 VCC 0 to 3 V 3 4
16 15 14 13
30 pF 30 pF
E.g., oscilloscope
5 6 7 8
12 11 10 9 30 pF 30 pF
*
Heavy-Load Drive Output Crosspoints
1 2 VCC 3 4
16 15 14 13 CL CL E.g., oscilloscope
5 6 0 to 3 V 7 8
12 11 10 9
CL CL
CL = 300 to 450 pF
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Example of an Application Circuit
(1) Connection to the TCD1503C
Signal output 1 Signal output 2
12 V
OS1 SS OD RS
2B
1 2 3 4
1
22 21 20 19
OS2 SS RS SH
2B
CP NC NC
20 10
6 7 8 9 10 11
TCD1503C
5
18 17 16 15 14 13
CP NC SS
2E 1E
NC
5000
12
NC
2B_ out Last transfer clock signal input Clamp gate signal input 5V 2B_in CP_in VCC
1 2 3 4
16 15 14 13
2B_out CP_out

GND
GND
VCC Transfer clock signal input Shift gate signal input Reset gate signal input CK_in SH_in RS_in
5 6 7 8
12 11 10 9

SH_out RS_out
Note:
Driving the CCD requires a lot of power. Toshiba recommends the use of a bypass capacitor connected to the 5 V power supply to stabilize voltage.
Precautions on Use
This product does not include built-in protection circuits for excess current or overvoltage. If the IC is subjected to excess current or overvoltage, it may be destroyed. Therefore systems incorporating the IC should be designed with the utmost care. Particular care is necessary in the design of the output, VCC and GND lines since the IC may be destroyed by short circuits between outputs, air contamination faults, or faults due to improper grounding.
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TB62801F
(2) Connection to the TCD1703C
Signal output 1 Signal output 2
12 V
OS1 OD CP RS 2B 102 202 SS 201 101 NC
1 2 3 4
1
22 21 20 19
OS2 SS CP RS 2B 1E2 2E2 SS 2E1 1E2 SH
6 7 8 9 10 11
TCD1703C
5
18 17 16 15 14 13
7500
12
2B_ out
1 2 3 4
16 15 14 13
2B_out CP_out
Last transfer clock signal input Clamp gate signal input 5V
2B_in CP_in VCC
GND
GND
VCC Transfer clock signal input Shift gate signal input Reset gate signal input CK_in SH_in RS_in
5 6 7 8
12 11 10 9
SH_out RS_out
2B_ out
1 2 3 4
16 15 14 13
2B_out CP_out
2B_in 5V CP_in VCC
GND
GND
VCC CK_in SH_in RS_in
5 6 7 8
12 11 10 9
SH_out RS_out
Note:
Driving the CCD requires a lot of power. Toshiba recommends the use of a bypass capacitor connected to the 5 V power supply to stabilize voltage. Two TB62801F devices are used in this application: one is used to drive all the control bits and the four transfer clock bits, the other to drive the remaining four transfer clock bits.
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Package Dimensions
HSOP16-P-300-1.00 Unit: mm
Weight: 0.5 g (typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
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IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
(2)
(3)
(4)
(5)
Points to Remember on Handling of ICs
(1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
(2)
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RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice. 021023_D
060116EBA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C * The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
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